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PCB
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| Specifications |
HTWY-4 |
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1 Surface processing type
Hot air levling, Soft gold, Hard gold HAL, OSP, Immersion gold
2 PCB layer quantity
Double-face to 30 layers
3 Minimum lead width 3mil
4 Minimum line ***ce between 3mil
5 Minimum line to tray, tray to tray ***ce between 3mil
6 Minimum drill diameter 0.10mm
7 Minimum hold solder diameter 12mil
8 Max. drill board thick% 1 :12.5
9 Max. molding size 23inch*35inch
10 Molding board thick area 0.21-7.0mm
11 Green ink minimum width 4mil
12 Green ink minimum unilateral Opening 1.5mil
13 Minimum green ink thickness 10um
14 Solder mask type Green, Yellow, Black, Blue or Clarity Sensitization Solder mask, peel off blue glue
15 Minimum character line width 4mil
16 Minimum character height 25mil
17 Silk-screen character color White, Yellow, Black
18 Data file format GERBER file and Corresponding Broach file, PROTEL Series, PADS2000, Powerpcb Series, ODB++
19 Eletricity performance testing 100% eletricity performance testing£»high-pressure testing
20 All kinds board for basic board to PCB processing High Tg board, high frequency board (ROGERS, TEFLON , TACONIC, ARLON), without halogen board, All kinds board press ability
21 Other testing request Impedance testing, hole resistance testing, gold slice up, solder , heat i***ct and regular security testing
22 Special craft ability Inter hole design, thick copper Multi-layer board
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| Company: |
Shenzhen HTWY Technology Co.,Ltd
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| Contact: |
Ms. Angel Dai |
| Address: |
Room 1103 Shanghai auto building,High-tech park,Nanshan,Shen |
| Postcode: |
518208 |
| Tel: |
86 0755 26738518-14 |
| Fax: |
86 0755 26738408 |
| E-mail: |
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